IPC Designer Certification Program
IPC CID+ (Advanced Certified Interconnect Designer)
Further expansion of competency in design is the keyword of this certification program.
Where the CID training provides the basic information and knowledge for design for manufacturing, assembly, and testing techniques, this training widens the competence of the candidates. Again, like with the CID training for this training course, the candidate is also supplied with all necessary course materials and a study guide a couple of weeks before the start of the training to prepare himself for the training session in the classroom instruction.
The IPC CID+ (Advanced Certified Interconnect Designer) certificate is a valuable credential recognized in the global electronics industry.
After the self-study period, he will find himself in the classroom with other candidates to discuss the topics of the applicable standards that form the basis of this training in order to prepare himself for the written exam.
Thus he widens and deepens his knowledge getting acquainted with more advanced design techniques and principles and will be fully prepared for his task as a PCB designer. The investment will pay off in that he will be more competent and confident even when confronted with highly sophisticated designs.
Prerequisites for CID+ training:
A prerequisite for this training is to have a valid Certified Interconnect Designer (CID) certificate.
Programme IPC CID+ (Advanced Certified Interconnect Designer)
1. DESIGN CONSIDERATIONS
1.1 Board Material Properties
1.2 Plating Characteristics for Conductors and Holes
1.3 Surface Finish and Treatment Characteristics
1.4 Solder Mask/Coating Material Properties and Compatibility
1.5 Homogenous Material Performance Capability
1.6 Statistical Process Control (SPC) with Test Coupons
1.7 Reliability and Stress Test Evaluations
1.8 Quality Life-Cycle Tracking
1.9 Materials and Compliance
1.10 Solder Joint Reliability
2. PRINTED BOARD CHARACTERISTICS
2.1 Design Standards to Meet Fabrication and Assembly Goals
2.2 Manufacturing Equipment Size Limitations
2.3 Printed Board Length to Width Relationships
2.4 Balanced Construction and Copper Balance
2.5 Printed Board Thermal Management Techniques
2.6 Controlled Expansion Constructions using Special Cores
2.7 Non-Standard Mechanical Outline (Case) Integration
2.8 Individual Board Tooling Considerations
2.9 HDI – Interconnect Vias Types and Strategies
3. ELECTRICAL PARAMETERS
3.1 Physical Board Dielectric Parameters
3.2 Shielding Techniques to Prevent Signal Emission
3.3 EMI and EMC Emission/Susceptibility
3.4 General Principals of Impedance Control
3.5 Signal Integrity Analysis
3.6 Electrical Clearance and Dielectric Spacing
3.7 Power and Ground Routing Techniques
3.8 Conductor Current Carrying Capacity vs. Temperature Rise
3.9 Layout Approaches for Crosstalk Minimization
4. COMPONENT AND ASSEMBLY ISSUES
4.1 Component Comparison between Area and Peripheral Arrays
4.2 Component Types and Mounting Strategies
4.3 Component Placement Strategy and Assembly Sequence
4.4 Component Mounting Shock and Vibration Requirements
4.5 Evaluation of Component Attachment Methods
5. DIMENSIONING AND DOCUMENTATION
5.1 Parts List Development – BOM (Bill Of Materials)
5.2 Printed Board Tolerance Analysis
5.3 Documentation to Facilitate Design to Fabrication Interface
5.4 Printed Board and Assembly Data Format Standardization
5.5 Assembly Repair and Modification Tools and Techniques
For a complete training program, more information, or any training-related questions, please don’t hesitate to contact us by telephone at +31(0)45-5703333, by E-Mail firstname.lastname@example.org.