IPC Designer Certification Program

IPC CID (Certified Interconnect Designer-basic)

Competency in design is the keyword of this certification program.
Rather than going into the actual process of using CAD systems the goal of this program is to provide candidates with all necessary information to transform an electrical circuit into a printed circuit design that is manufacturable and can be assembled to the criteria of the applicable IPC standards.

IPC CID (Certified Interconnect Designer) is recognized globally throughout the electronics industry as a valuable professional credential.

The student’s knowledge is assessed and enhanced. He is guided through an internationally accepted, standardized set of rules and criteria used throughout the global electronics producing industry.

This certification program differs from the other typical IPC certification training courses. To prepare himself the candidate is supplied with all necessary course materials and a study guide a couple of weeks before the start of the training.
The training session itself is performed as a classroom instruction. Thus the candidates will get an extensive review of the course materials and can discuss the content with the trainer. By doing so the candidate is provided with all necessary knowledge and can enter the final exam well prepared. All candidates that successfully pass the exam are awarded with their CID certificate and are eligible for the CID+ certification.

Programme CID (Certified Interconnect Designer-basic)

1. DESIGN CONSIDERATIONS
1.1 Considerations for Design
1.2 Placement and Routing Techniques
1.3 Electrical Characteristics
1.4 Copper Clad Laminates
1.5 Holes in Printed Boards
1.6 Drilling and Hole Locations
1.7 Features Formed in Copper

2. THERMAL, RELIABILITY, AND TESTING ISSUES
2.1 Thermal Management of Boards
2.2 Thermal Management of Assemblies
2.3 Reliability
2.3.1 Materials and Compliance
2.3.2 Terms & Long Term PCB Design Issues
2.3.3 Reliability – Component Solder Joint
2.4 Board and Assembly Testing

3. PHYSICAL BOARD PRINCIPLES
3.1 Printed Board and Assembly Viewing Principles
3.2 Introduction to Datum Dimensioning
3.3 Grid Systems
3.4 Tooling Holes and Fiducials
3.5 Board and Assembly Penalization
3.6 Panel Separation Methods

4. COMPONENT TYPES
4.1 Basic Components
4.2 Embedded Components
4.3 Edge Board Connectors128
4.4 Stiffeners 4.5 Bus Bars
4.6 Sockets
4.7 Jumpers and Terminals
4.8 MELFs
4.9 Eyelets

5. COMPONENT AND ASSEMBLY ISSUES
5.1 Designing for Manufacturability
5.2 Mounting Through-hole Components
5.3 Mounting Surface Mount Components
5.4 Component Modifications
5.5 Component Insertion and Attachment Techniques
5.6 Solder Processes
5.7 Clinched Leads

6 BOARD SURFACE TREATMENTS
6.1 Solder Mask
6.2 Conformal Coatings
6.3 Protective Coatings / Surface Finishes
6.4 Legend
6.5 Conductive Inks

7 DOCUMENTATION AND DIMENSIONING
7.1 Documentation and Classifications

For a complete training program, more information, or any training-related questions, please don’t hesitate to contact us by telephone at +31(0)45-5703333, by E-Mail sales@piek.email.

Training Calendar